Automatic Packaging Production Line for Optical Modules

iPronics is unveiling a dedicated manufacturing line for the packaging, assembly, testing, and qualification of its ONE Series SiPh OCS, enabling volume production from wafers to line cards that integrate into the customer's rack. The EXALOS Hybrid Optical Packaging Platform (HOPP) is a packaging technology that has been developed and used since 2008 for realizing advanced optical modules with miniature components (millimeter-size or smaller) that are aligned and assembled with micron-level or even sub-micron precision. The. ficonTEC provides device micro-assembly and testing solutions for the photonic device industry. These solutions are realized as cutting-edge, high-precision production systems utilizing advanced automation approaches, regardless of the device material and target application. Our modular system. VALENCIA, Spain, March 17, 2026 (GLOBE NEWSWIRE) — iPronics, the leader in programmable silicon photonics (SiPh) for AI datacenter networking, today announced a major expansion of its global manufacturing capability through a deepened partnership with Fabrinet (NYSE: FN), a world-class, Tier 1. SEMIPHOTON, INC. together with our manufacturing Partners, offers state-of-the-art fully-automated and semi-automated Solar/PV modules production lines, designed to fit any capacity and factory size. [PDF]